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05192
ULLC0402FC05C*
UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
APPLICATIONS
Cellular Phones Personal Digital Assistant (PDA) Notebook Computers SMART Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns
U0402
FEATURES
ESD Protection > 25 kilovolts Low ESD Overshoot Voltage Bidirectional Configuration & Monolithic Structure Protects 1 Line Low Capacitance: 6pF Low Leakage Current RoHS Compliant
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0402 Weight 0.73 milligrams (Approximate) Solder Reflow Temperature: Lead-Free: 260-270C Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Device Marking On Reel
PIN CONFIGURATION
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*U.S. Patent No. 6,867,436 www.protekdevices.com
ULLC0402FC05C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
PARAMETER
Operating Temperature Storage Temperature
SYMBOL
TJ TSTG
VALUE
-55C to 150C -55C to 150C
UNITS
C C
ELECTRICAL CHARACTERISTICS PER LINE
PART NUMBER (See Notes 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE
@ 25C Unless Otherwise Specified MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE
V WM VOLTS ULLC0402FC05C Note 1: Device is bidirectional. 5.0
@ 1mA V(BR) VOLTS 6.0
@V WM ID A 1.0
0V @ 1 MHz C pF 6
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ULLC0402FC05C
GRAPHS
FIGURE 1 OVERSHOOT & CLAMPING VOLTAGE
35
25
5 Volts per Division
15
5
-5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 2 CAPACITANCE VS REVERSE VOLTAGE
10
8
Cj - Capacitance - pF
6
4
2
0 0 1 2 3 4 5 6
VR - Reverse Voltage - Volts
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ULLC0402FC05C
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature
VALUE
0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C
REQUIREMENTS
Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating.
RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
TP Ramp-up
Temperature - C
Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat
t 25C to Peak 30-60 seconds
Ramp-up 15 seconds
Solder Time 15-20 seconds
Ramp-down
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ULLC0402FC05C
U0402 PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE DIM
A B C D E F I
PACKAGE DIMENSIONS MILLIMETERS
0.61 NOM 0.86 NOM 0.99 0.0254 0.10 NOM 0.35 NOM 0.483 0.0254 0.406 NOM
INCHES
0.024 NOM 0.034 NOM 0.039 0.001 0.004 NOM 0.014 NOM 0.019 0.001 0.016 NOM
TOP
AB
C
E F Metalized Die Contacts
D
SIDE
END
I
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Maximum chip size: 1.02 (0.040") by 0.51(0.020").
MOUNTING PAD
B C A
SOLDER PAD
PAD DIMENSIONS DIM
D
MILLIMETERS
0.23 0.48 0.69 0.46 0.99 0.20 0.20 0.66 0.13
INCHES
0.009 0.019 0.027 0.018 0.039 0.008 0.008 0.026 0.005
DIE CONTACTS
F E
DIE
H
A B C D E F G H I
NOTE: 1. Top view of tape. Metal contacts are face down in tape package.
TAPE & REEL ORIENTATION
SOLDER PRINT DIAMETER 0.010 - 0.012
G
TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering suffix:: -T75-1, i.e., ULLC0402FC05C-T75-1. 3. 8mm Paper Tape: 7 Inch Reels -10,000 pieces per reel. Ordering suffix : -T710-2, i.e., ULLC0402FC05C-T710-2.
Single Die - 0402
NOTE: 1. Preferred: Using 0.1mm (0.004") stencil. Outline & Dimensions: Rev 4 - 10/05, 6020
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia. 178mm (7")/330mm(13") Tape Width 8mm A0 B0 K0 D E F W P0 P2 P tmax 0.25
0.80 0.10 1.20 0.10 0.70 0.10 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 2.00 0.10
P0 t D P2 10 Pitches Cumulative Tolerance on Tape. 0.2
E Top cover tape A0 K0 B0 F W
P
User Direction of Feed
COPYRIGHT (c) ProTek Devices 2006 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
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